Intel, Samsung, TSMC Target 2012 for 450mm Wafer Manufacturing Transition

Intel Corp, Samsung Electronics and TSMC have collaborated to target a transition to 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and help maintain a reasonable cost structure for future integrated circuit manufacturing and applications.

The companies said they will cooperate with the semiconductor industry to help ensure that all of the required components, infrastructure and capability are developed and tested for a pilot line by this target date.

Historically, manufacturing with larger wafers helps increase the ability to produce semiconductors at a lower cost. The total silicon surface area of a 450mm wafer and the number of printed die is more than twice that of a 300mm wafer. The bigger wafers help lower the production cost per chip. In addition, through efficient use of energy, water and other resources, bigger wafers can help diminish overall use of resources per chip.

The three companies indicate that the semiconductor industry can improve its return on investment and substantially reduce 450mm R&D costs by applying aligned standards, rationalizing changes from 300mm infrastructure and automation, and working toward a common timeline. The companies also agree that a cooperative approach will help minimize risk and transition costs.

In the past, migration to the next larger wafer size traditionally began every 10 years after the last transition. For example, the industry began the transition to 300mm wafers in 2001, a decade after the initial 200mm manufacturing facilities were introduced in 1991.

Keeping in line with the historical pace of growth, Intel, Samsung and TSMC agree that 2012 is an appropriate target to begin the 450mm transition. Given the complexity of integrating all of the components for a transition of this size, the companies recognize that consistent evaluation of the target timeline will be critical to ensure industry-wide readiness.

The three companies will continue to work with International Sematech (ISMI), as it plays a critical role in coordinating industry efforts on 450mm wafer supply, standards setting and developing equipment test bed capabilities.

source:
http://techon.nikkeibp.co.jp /english/NEWS_EN/20080506/151342/